分子动力学方法研究铜/环氧树脂界面黏结性能Molecular Dynamics Simulation on Adhesion Properties of Cu/epoxy Interface
辛东嵘;辛浩;
摘要(Abstract)：
采用分子动力学方法研究了电子封装界面铜/环氧树脂相互作用能,并考虑环氧树脂交联程度、温度和含湿量的影响.研究结果表明,环氧树脂交联程度对铜/环氧树脂界面相互作用能几乎没有影响,而高温和高湿都会使铜/环氧树脂界面黏结性能明显下降.分析表明,湿气含量较高时,湿气穿越环氧树脂层聚集在铜与环氧树脂之间.
关键词(KeyWords)： 分子动力学;相互作用能;高温高湿
基金项目(Foundation): 国家自然科学基金资助项目,编号11402164;; 福建省自然科学基金资助项目,编号2015J05001;; 福建省中青年教师教育科研项目,编号JA14220;; 福建工程学院科研启动基金,编号GY-Z14070;; 广东省博士启动基金,编号S201304001676
作者(Authors): 辛东嵘;辛浩;
参考文献(References)：
- [1]Kim W,Yun I,Lee J,et al.Evaluation of mechanical interlock effect on adhesion strength of polymer-metal interfaces using micro-patterned surface topography[J].Int J Adhes Adhes,2010,30(6):408-417.
- [2]Lau D,Büyükoztürk O.Fracture characterization of concrete/epoxy interface affected by moisture[J].Mech Mater,2010,42(12):1031-1042.
- [3]Kolluri M,Hoefnagels J P M,Dommelen J A W,et al.An improved miniature mixed-mode delamination setup forin situmicroscopic interface failure analyses[J].J Phys D Appl Phys,2011,44(3):34005-34020.
- [4]Tran H,Shirangi M H,Pang X,et al.Temperature,moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness[J].Int J Fracture,2014,185(1/2):115-127.
- [5]贾洪亮,王峰,张宇,等.对溴苯基咪唑二羧酸构筑的锶配聚物的合成、晶体结构及性能[J].郑州大学学报:理学版,2014,46(2):85-89.
- [6]韩国胜,张宇虹,康静艳,等.4,4'-二氯甲基联苯自聚合树脂合成条件优化及表征[J].郑州大学学报:理学版,2014,46(2):73-76.
- [7]Kisin S,Bozovic Vukic J,van der Varst P G T,et al.Estimating the polymer-metal work of adhesion from molecular dynamics simulations[J].Chem Mater,2007,19(4):903-907.
- [8]Zhou S,Cheng X,Jin Y,et al.Molecular dynamics simulation on interacting and mechanical properties of polylactic acid and attapulgite(100)surface[J].J Appl Polym Sci,2013,128(5):3043-3049.
- [9]Zhang X,Du L,Xu Z.The effect of soft bake on adhesion property between Su-8 photoresist and Ni substrate by molecular dynamics simulation[J].J Appl Polym Sci,2013,127(6):4456-4462.
- [10]Youssefian S,Rahbar N.Nano-scale adhesion in multilayered drug eluting stents[J].J Mech Behav Biomed,2013,18:1-11.
- [11]Hadden C,Jensen B,Bandyopadhyay A,et al.Molecular modeling of EPON-862/graphite composites:Interfacial characteristics for multiple crosslink densities[J].Compos Sci Technol,2013,76:92-99.
- [12]Qiang L,Li Z,Zhao T,et al.Atomic-scale interactions of the interface between chitosan and Fe3O4[J].Colloids Surf A,2012,419:125-132.
- [13]Ledyastuti M,Liang Y,Matsuoka T.The first-principles molecular dynamics study of quartz-water interface[J].Int J Quantum Chem,2013,113(4):401-412.
- [14]Cheng H,Hsu Y,Wu C,et al.Molecular dynamics study of interfacial bonding strength of self-assembled monolayer-coated Au-epoxy and Au-Au systems[J].Appl Surf Sci,2011,257(20):8665-8674.
- [15]Xin D,Han Q.Study on interfacial interaction energy of Cu-SAM-epoxy systems in a hot and humid environment[J].J Adhes Sci Technol,2014,28(5):434-443.
- [16]Fan H,Chan E,Wong C,et al.Molecular dynamics simulation of thermal cycling test in electronic packaging[J].J Electron Packaging,2007,129(1):35-40.
- [17]Yang S,Gao F,Qu J.A molecular dynamics study of tensile strength between a highly-crosslinked epoxy molding compound and a copper substrate[J].Polymer,2013,54(18):5064-5074.